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1 SAW81F1D C chip on board product data sheet product brief description ???? ? ????? ???? ???? ?? : ?? ?? ??? ?? ?? ? ???? ? ? ?? ? ???? : ??? ?? ?? ?? 5cm ?? ?? ?? ??? ?? ( ???? ?? ?? ) key applications features and benefits ? key message: - ex) enabling high flux systems while reduces led count - ex) enabling compact systems with high reliability - ex) high reliability and high quality of light - ex) flicker - free ac/dc led solution - ex) high - efficient dimming solution ? product family: - ex) mid - power led - ex) high - power led for automotive - ex) chip on board ? product id (part number): - ex) stw8c2sa - ex) sz5 - m0 - wn - c8 ? description ? ? features and benefits ? ? key applications ? ? ?? ??? table ?? #. ? ?? ? ???? ?? . www.seoulsemicon.com font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt certificate ??? ?? ( ???? ??? ??? ?? ?????? ?? ?? ) rev1.0, apr 6, 2016 enable high flux and cost efficient system SAW81F1D z power chip on board C zc series ? the zc series are led arrays which provide high flux and high efficacy. ? especially it is designed for easy assembly of lighting fixtures by eliminating reflow soldering process. ? its thermal management is better than other power led solutions with wide metal area. ? zc series are ideal light sources for general lighting applications including replacement lamps, industrial & commercial lightings and other high lumen required applications. ? replacement lamps C bulb, mr16, par ? commercial C downlight ? residential table 1. product selection table automotive lighting, mr16, par, down light bulb, lft outdoor, streetlight, tunnel, parking home appliance architectural, entertainment sign, channel sensor, torch application ???? ??? ?? rohs lm - 80 tv, pc, nb, mnt, mobile troffer , highbay macadam 3 - step rohs part number cct [k] color min. typ. max. SAW81F1D cool white 4,700k 5,600k 7,000k neutral white 3,700k 4,200k 4,700k warm white 2,600k 3,000k 3,700k ? size 10.8mm * 10.8mm ? power dissipation 3.7w ? erp 6 - step binning ? high color quality with cri min.80(r9>0) ? uniformed shadow ? excellent thermal management ? rohs compliant
2 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 ? table of contents ? product brief ?? ?? ?? table of contents index ? product brief 1 ? table of contents 2 ? product performance & characterization guide 3 ? characteristics graph 5 ? product nomenclature ( labeling information ) 11 ? color bin structure 12 ? mechanical dimensions 14 ? handling of silicone resin for leds 17 ? precaution for use 18 ? company information 21
3 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 performance characteristics ? ??? ?? ? ? ?? ?? ??? table 2. electro optical characteristics, i f =20ma 1. correlated color temperature is derived from the cie 1931 chromaticity diagram. color coordinate(x, y) : ? 0.005, cct ? 5% tolerance. 2. seoul semiconductor maintains a tolerance of 5% on flux and power measurements. 3. v is the total luminous flux output as measured with an integrating sphere. 4. tolerance is 3% on forward voltage measurements. 5. tolerance is 2 on cri measurements. * no values are provided by real measurement. only for reference purpose. part number cct (k) [1] typical luminous flux [2] v [3] [ lm] typical forward voltage [v] cri [5] , r a viewing angle [degrees ] 2 ? typ. tj =25 tj =85 tj =25 tj =85 min . typ . SAW81F1D 6500 485 439 185 175 80 120 4000 510 462 80 120 3000 475 430 80 120 notes for table 2:
4 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 performance characteristics ? ??? ?? ? ? ?? ?? ??? parameter symbol value unit min. typ. max. forward current i f - 20 40 ma power dissipation p d - 3.7 7.6 w junction temperature [1] t j - - 125 oc operating temperature t opr - 40 - 85 oc surface temperature t s - - 100 oc storage temperature t stg - 40 - 100 oc thermal resistance (j to s) rth js - 2.9 - k/w esd sensitivity(hbm) [2] - class 2a jesd22 - a114 - e table 3. absolute maximum characteristics, t j =25oc 1. at thermal resistance, j to s means junction to cobs metal pcb bottom. 2. at esd sensitivity, class 2 is voltage level between 2000v and 4000v. 3. thermal resistance : rth js (junction / solder) notes for table 3 : ? leds properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. care is to be taken that power dissipation does not exceed the absolute maximum rating of the product . ? thermal resistance can be increased substantially depending on the heat sink design/operating condition, and the maximum possible driving current will decrease accordingly. ? all measurements were made under the standardized environment of seoul semiconductor.
5 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 1. color spectrum , i f =20ma , t j =25 fig 2. radiant pattern, i f =20ma , t j =25 -100 -75 -50 -25 0 25 50 75 100 0 20 40 60 80 100 relative luminous intensity [%] angular displacement [degree] 400 500 600 700 800 0 20 40 60 80 100 relative radiant power [%] wavelength [nm] 6500k 4000k 3000k
6 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 3. forward voltage vs. forward current, t j =85 fig 4. forward current vs. relative luminous flux, t j =85 155 160 165 170 175 180 185 190 195 0 5 10 15 20 25 30 35 40 45 forward current [ma] forward voltage [v] 0 10 20 30 40 50 0 40 80 120 160 200 relative luminous flux [%] forward current [ma]
7 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 5. relative light output vs. junction temperature, i f =20ma fig 6. forward voltage vs. junction temperature, i f =20ma cct: 3000k cct: 3000k 20 40 60 80 100 120 140 0 20 40 60 80 100 relative forward voltage[%] junction temperature [ o c] 20 40 60 80 100 120 140 0 20 40 60 80 100 relative luminous flux [%] junction temperature [ o c]
8 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . fig 7. forward current vs. cie x, y shift, t j = 85oc cct: 3700 - 7000k cct: 2600 - 3700k 20 30 40 50 60 70 80 -0.02 -0.01 0.00 0.01 0.02 ciex ciey relative variation[a.u.] forward current [ma] 20 30 40 50 60 70 80 -0.02 -0.01 0.00 0.01 0.02 ciex ciey relative variation[a.u.] forward current [ma]
9 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 characteristics graph product data sheet ? ?? ???? ??? x ? / y ?? ??? . cct: 3700 - 7000k cct: 2600 - 3700k fig 8 . junction temperature vs. cie x, y shift, i f =20ma 25 50 75 100 125 150 -0.02 -0.01 0.00 0.01 0.02 ciex ciey relative variation[a.u.] junction temperature [ o c] 25 50 75 100 125 150 -0.02 -0.01 0.00 0.01 0.02 ciex ciey relative variation[a.u.] junction temperature [ o c]
10 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 product data sheet characteristics graph ? ?? ???? ??? x ? / y ?? ??? . fig 9 . ambient temperature vs. maximum forward current, t j (max.)=125 0 20 40 60 80 100 120 0 10 20 30 40 50 rth(j-a) = 6k/w rth(j-a) = 8k/w rth(j-a) = 10k/w forward current [ma] ambient temperature t a [ o c]
11 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 product nomenclature ? ?? ??? (nomenclature) part number code description part number value x 1 company s x 2 package series a x 3 x 4 color specification w8 cri 80 x 5 series number 1 x 6 lens type f flat x 7 pcb type 1 pcb x 8 revision number d lot number code description lot number value y 1 y 2 year y 3 y 4 month y 5 y 6 day y 7 y 8 y 9 y 10 mass order y 11 y 12 y 13 tray no. table 4. part numbering system : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 table 5. lot numbering system : y 1 y 2 y 3 y 4 y 5 y 6 C y 7 y 8 y 9 y 10 C y 11 y 12 y 13
12 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 color bin structure ? color bin cie ???? ? ?? ??? . cct rank center point a b ellipse rotation angle(degrees) cx cy 6,500k ae6 0.3130 0.3370 0.02622 0.01136 57.46 5,000k ce6 0.3460 0.3590 0.03273 0.01397 57.48 4,000k ee6 0.3800 0.3800 0.03786 0.01642 53.92 3,000k ge6 0.4400 0.4030 0.03492 0.01678 53.85 2,700k he6 0.4630 0.4200 0.02985 0.01598 57.59 cie chromaticity diagram, i f = 20ma , ts =8 5 1. cx and cy are the center coordinates of the ellipse, a the length of the major axis, b the length of the minor axis and the angle of the major axis as defined in iec 60081 . notes : 0.30 0.33 0.36 0.39 0.42 0.45 0.48 0.30 0.33 0.36 0.39 0.42 0.45 ansi erp 6step ellipse 2700k 3000k 5000k 6500k 4000k y x
13 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 color bin structure ? color bin cie ???? ? ?? ??? . table 6. bin code description, i f = 20ma part number cct cie lf rank vf rank SAW81F1D 6000~7000k a a3 a4 x5 x6 5300~6000k b a3 a4 x5 x6 4700~5300k c a3 a4 x5 x6 3700~4200k d a3 a4 x5 x6 3700~4200k e a3 a4 x5 x6 3100~3700k f a3 a4 x5 x6 2900~3100k g a3 a4 x5 x6 2600~2900k h a3 a4 x5 x6 available ranks table 7. ordering information(bin code) 1. flux values @ 85 c are calculated and for reference only. notes for table 6: part number luminous flux (lm) [ 1] color chromaticity coordinate tj =8 5 typical forward voltage (v ) bin no . tj =25 tj =85 bin no . tj =25 tj =85 min. max. min. max. min. max. min. max. SAW81F1D a3 420 460 374 410 refer to page.12 x5 180 190 170 180 a4 460 500 410 440 x6 190 200 180 190
14 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 mechanical dimensions notes : 1. all dimensions are in millimeters. 2. scale : none 3. undefined tolerance is 0.2mm cathode anode < inner circuit diagram> x 4 marking1 top view side view
15 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 packaging specification 1. quantity : 30pcs/tray 2. all dimensions are in millimeters (tolerance : 0.3) 3. scale none notes : top view side view
16 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 packaging specification notes : 1. heat sealed after packing (use zipper bag) 2. quantity : 3tray(90pcs) /bag aluminum bag outer box
17 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 handling of silicone resin for leds (1) during processing, mechanical stress on the surface should be minimized as much as possible. sharp objects of all types should not be used to pierce the sealing compound. (3) silicone differs from materials conventionally used for the manufacturing of leds. these conditions must be considered during the handling of such devices. compared to standard encapsulants , silicone is generally softer, and the surface is more likely to attract dust. as mentioned previously , the increased sensitivity to dust requires special care during processing. in cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) seoul semiconductor suggests using isopropyl alcohol for cleaning. in case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. ultrasonic cleaning is not recommended. ultrasonic cleaning may cause damage to the led. (5) please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) avoid leaving fingerprints on silicone resin parts. (2) in general, leds should only be handled from the side. by the way, this also applies to leds without a silicone sealant, since the surface can also become scratched.
18 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 precaution for use (1) storage to avoid the moisture penetration, we recommend storing power leds in a dry box with a desiccant. the recommended storage temperature range is 5c to 30c and a maximum humidity of 50%. (2) use precaution after opening the packaging. pay attention to the following: a. recommend conditions after opening the package - sealing - temperature : 5 ~ 40 humidity : less than rh30% b. if the package has been opened more than 4 week or the color of the desiccant changes. (3) for manual soldering seoul semiconductor recommends the soldering condition (zc series product is not adaptable to reflow process) a. use lead - free soldering b. soldering should be implemented using a soldering equipment at temperature lower than 350 c. c. before proceeding the next step, product temperature must be stabilized at room temperature. (4) components should not be mounted on warped (non coplanar) portion of pcb. (5) radioactive exposure is not considered for the products listed here in. (6) it is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) this device should not be used in any type of fluid such as water, oil, organic solvent and etc. when washing is required, ipa (isopropyl alcohol) should be used. (8) when the leds are in operation the maximum current should be decided after measuring the package temperature. (9) leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from seoul semiconductor , a sealed container with vacuum atmosphere should be used for storage. (10) the appearance and specifications of the product may be modified for improvement without notice.
19 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 precaution for use (11) long time exposure of sun light or occasional uv exposure will cause silicone discoloration. (12) attaching leds, do not use adhesive that outgas organic vapor. ( 13) the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage. (14) please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (15) vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor when exposed to heat and photonic energy. the result can be a significant loss of light output from the fixture. knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (16) leds are sensitive to electro - static discharge (esd) and electrical over stress (eos). below is a list of suggestions that seoul semiconductor purposes to minimize these effects . a. esd (electro static discharge) electrostatic discharge (esd) is the defined as the release of static electricity when two objects come into contact. while most esd events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. the damage from esd to an leds may cause the product to demonstrate unusual characteristics such as : - increase in reverse leakage current lowered turn - on voltage - abnormal emissions from the led at low current the following recommendations are suggested to help minimize the potential for an esd event. one or more recommended work area suggestions : - ionizing fan setup - esd table/shelf mat made of conductive materials - esd safe storage containers one or more personnel suggestion options : - antistatic wrist - strap - antistatic material shoes - antistatic clothes environmental controls: - humidity control (esd gets worse in a dry environment)
20 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 precaution for use b. eos (electrical over stress) electrical over - stress (eos) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. the effects from an eos event can be noticed through product performance like: - changes to the performance of the led package (if the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - changes to the light output of the luminaire from component failure - components on the board not operating at determined drive power failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. it is impossible to predict the failure mode of every led exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an eos event has occurred: - damaged may be noticed to the bond wires (appearing similar to a blown fuse) - damage to the bond pads located on the emission surface of the led package (shadowing can be noticed around the bond pads while viewing through a microscope) - anomalies noticed in the encapsulation and phosphor around the bond wires. - this damage usually appears due to the thermal stress produced during the eos event. c. to help minimize the damage from an eos event seoul semiconductor recommends utilizing: - a surge protection circuit - an appropriately rated over voltage protection device - a current limiting device
21 rev1.0, apr 6, 2016 www.seoulsemicon.com product data sheet SAW81F1D C chip on board ? ?? ? C ?? ? ? ?????? . ?? ?? ???? ???? ????? ???? . ( ? ) sz5m0wwc9 C high - power led font ??? ? (table) - ?? : arial 10pt, ? ?? : arial 8pt, ?? (body) C arial 9pt ? revision numbering ?? : ? ???? 0.0 ?? ?? 0.x. ? final ??? : 1.0 ?? ?? ? ???? ?? ?? : +0.1 ? ??? data ?? / ?? ?? ? ?? : +1.0 ? ???? ???? ; yyyy - mm - dd ( ? ) 2013 - 04 - 01 company information published by seoul semiconductor ? 2013 all rights reserved. company information seoul semiconductor (seoulsemicon.com) manufacturers and packages a wide selection of light emitting diodes (leds) for the automotive, general illumination/lighting, appliance, signage and back lighting markets. the company is the worlds fifth largest led supplier, holding more than 10,000 patents globally, while offering a wide range of led technology and production capacity in areas such as npola , deep uv leds, " acrich ", the worlds first commercially produced ac led, and " acrich mjt - multi - junction technology" a proprietary family of high - voltage leds. the companys broad product portfolio includes a wide array of package and device choices such as acrich , high - brightness leds, mid - power leds, side - view leds, through - hole type led lamps, custom displays, and sensors. the company is vertically integrated from epitaxial growth and chip manufacture in its fully owned subsidiary, seoul viosys , through packaged leds and led modules in three seoul semiconductor manufacturing facilities. seoul viosys also manufactures a wide range of unique deep - uv wavelength devices. legal disclaimer information in this document is provided in connection with seoul semiconductor products. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, seoul semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non - infringement of intellectual property rights of any third party. the appearance and specifications of the product can be changed to improve the quality and/or performance without notice. ???? 1) revision ? ?? ????? ???? ???? ?? ?? ??? ????? ? ???? ?? pdf ? ???? ?? 2) data sheet ????? ??? ??? ??? ?? ?? ??

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